TY - GEN
T1 - Multi-wafer virtual probe
T2 - 2010 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2010
AU - Zhang, Wangyang
AU - Li, Xin
AU - Acar, Emrah
AU - Liu, Frank
AU - Rutenbar, Rob
PY - 2010
Y1 - 2010
N2 - In this paper, we propose a new technique, referred to as MultiWafer Virtual Probe (MVP) to efficiently model wafer-level spatial variations for nanoscale integrated circuits. Towards this goal, a novel Bayesian inference is derived to extract a shared model template to explore the wafer-to-wafer correlation information within the same lot. In addition, a robust regression algorithm is proposed to automatically detect and remove outliers (i.e., abnormal measurement data with large error) so that they do not bias the modeling results. The proposed MVP method is extensively tested for silicon measurement data collected from 200 wafers at an advanced technology node. Our experimental results demonstrate that MVP offers superior accuracy over other traditional approaches such as VP [7] and EM [8], if a limited number of measurement data are available.
AB - In this paper, we propose a new technique, referred to as MultiWafer Virtual Probe (MVP) to efficiently model wafer-level spatial variations for nanoscale integrated circuits. Towards this goal, a novel Bayesian inference is derived to extract a shared model template to explore the wafer-to-wafer correlation information within the same lot. In addition, a robust regression algorithm is proposed to automatically detect and remove outliers (i.e., abnormal measurement data with large error) so that they do not bias the modeling results. The proposed MVP method is extensively tested for silicon measurement data collected from 200 wafers at an advanced technology node. Our experimental results demonstrate that MVP offers superior accuracy over other traditional approaches such as VP [7] and EM [8], if a limited number of measurement data are available.
UR - http://www.scopus.com/inward/record.url?scp=78650872315&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=78650872315&partnerID=8YFLogxK
U2 - 10.1109/ICCAD.2010.5654349
DO - 10.1109/ICCAD.2010.5654349
M3 - Conference contribution
AN - SCOPUS:78650872315
SN - 9781424481927
T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
SP - 47
EP - 54
BT - 2010 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2010
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 7 November 2010 through 11 November 2010
ER -