Multi-physics modeling for laser micro transfer printing delamination

Ala'a M. Al-Okaily, Placid M. Ferreira

Research output: Contribution to journalConference article

Abstract

Micro-transfer printing technology is rapidly emerging as an effective pathway for large-scale heterogeneous materials integration. Laser Micro Transfer Printing (LMTP) is a laser-driven non-contact variant of the process that makes it independent of the receiving substrate's properties, geometry, and preparation. In this paper, an opto-thermo-mechanical model is developed to understand the laser optical absorption and thermally-induced strains around the ink-stamp interface during the LMTP process. The model will be used in planning the process parameters (laser pulse duration, stand-off distance), estimating the ink-stamp temperature rise during the LMTP process, and understanding the LMTP process capabilities and delamination mechanism. Further, experimental observations are used to calibrate the model and verify its predictions.

Original languageEnglish (US)
Pages (from-to)488-497
Number of pages10
JournalTransactions of the North American Manufacturing Research Institution of SME
Volume42
Issue numberJanuary
StatePublished - Jan 1 2014
Event42nd North American Manufacturing Research Conference 2014, NAMRC 2014 - Detroit, United States
Duration: Jun 9 2014Jun 13 2014

Keywords

  • Flexible electronics
  • Fracture mechanics
  • Laser micro-assembly
  • Micro-transfer printing
  • Modeling and simulation

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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