Multi-physics analysis of high-power ICs using non-conformal domain decomposition method

Yang Shao, Zhen Peng, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

One of the major difficulties in analyzing real-life engineering systems is the interaction amongst many different physical phenomena and their closely interconnected couplings. The purpose of this work is to develop a coanalyses methodology to address both electromagnetic (EM) and thermal effects for modeling high power integrated circuit (ICs), package and printed circuit boards (PCB). We use non-conformal domain decomposition method (DDM) for both electric and thermal analysis of high-power ICs. Non-conformal DDM decomposes the original problem domain into several non-overlapping sub-domains and thus can be effective for solving multiscale engineering problems. Furthermore, in the current approach, the thermal cooling is performed through heat sinks with both natural convection and air forced convection cooling.

Original languageEnglish (US)
Title of host publicationProceedings - 2011 International Conference on Electromagnetics in Advanced Applications, ICEAA'11
Pages1058-1061
Number of pages4
DOIs
StatePublished - Nov 7 2011
Externally publishedYes
Event2011 13th International Conference on Electromagnetics in Advanced Applications, ICEAA'11 - Torino, Italy
Duration: Sep 12 2011Sep 16 2011

Publication series

NameProceedings - 2011 International Conference on Electromagnetics in Advanced Applications, ICEAA'11

Conference

Conference2011 13th International Conference on Electromagnetics in Advanced Applications, ICEAA'11
CountryItaly
CityTorino
Period9/12/119/16/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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