Multi-dimensional modeling of the XPAL system

Andrew D. Palla, David L. Carroll, Joseph T. Verdeyen, Jason D. Readle, Thomas M. Spinka, Clark J. Wagner, James Gary Eden, Michael C. Heaven

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The exciplex pumped alkali laser (XPAL) system was recently demonstrated in mixtures of Cs vapor, Ar, and ethane, by pumping Cs-Ar atomic collision pairs and subsequent dissociation of diatomic, electronically-excited CsAr molecules (exciplexes or excimers). Because of the addition of atomic collision pairs and exciplex states, modeling of the XPAL system is far more complicated than classic diode pumped alkali laser (DPAL) modeling. In this paper we discuss BLAZE-V multi-dimensional modeling of this new laser system and compare with experiments.

Original languageEnglish (US)
Title of host publicationHigh Energy/Average Power Lasers and Intense Beam Applications IV
DOIs
StatePublished - May 6 2010
EventHigh Energy/Average Power Lasers and Intense Beam Applications IV - San Francisco, CA, United States
Duration: Jan 25 2010Jan 26 2010

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume7581
ISSN (Print)0277-786X

Other

OtherHigh Energy/Average Power Lasers and Intense Beam Applications IV
CountryUnited States
CitySan Francisco, CA
Period1/25/101/26/10

Keywords

  • BLAZE
  • DPAL
  • Diode pumped alkali laser
  • Exciplex pumped alkali laser
  • XPAL

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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  • Cite this

    Palla, A. D., Carroll, D. L., Verdeyen, J. T., Readle, J. D., Spinka, T. M., Wagner, C. J., Eden, J. G., & Heaven, M. C. (2010). Multi-dimensional modeling of the XPAL system. In High Energy/Average Power Lasers and Intense Beam Applications IV [75810L] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7581). https://doi.org/10.1117/12.845917