Monte Carlo simulation of the electrodeposition of copper. II. Acid sulfate solution with blocking additive

Timothy J. Pricer, Mark J. Kushner, Richard C. Alkire

Research output: Contribution to journalArticlepeer-review

Abstract

Simulation of copper electrodeposition in the presence of a hypothetical blocking additive was carried out by a linked continuum/noncontinuum numerical code for various geometric configurations in the shape of a rectangular trench. The mechanism of copper electrodeposition described in Part I of this series was extended to include a single additive species. The hypothetical additive had the property that it blocks deposition but is consumed at the surface, and that its arrival at the electrode surface is transport-limited so that leveling occurs. With use of numerical simulations carried out witha linked Monte Carlo-finite difference code described in Part I, the effect on trench in-fill of additive concentration, adsorption rate, consumption (breakdown) rate, and trench aspects ratio was investigated.

Original languageEnglish (US)
Pages (from-to)C406-C412
JournalJournal of the Electrochemical Society
Volume149
Issue number8
DOIs
StatePublished - Aug 2002

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Renewable Energy, Sustainability and the Environment

Fingerprint

Dive into the research topics of 'Monte Carlo simulation of the electrodeposition of copper. II. Acid sulfate solution with blocking additive'. Together they form a unique fingerprint.

Cite this