Monte Carlo simulation of the electrodeposition of copper I. Additive-Free acidic sulfate solution

Timothy J. Pricer, Mark J. Kushner, Richard C. Alkire

Research output: Contribution to journalArticlepeer-review

Abstract

Simulation of copper electrodeposition on an initially flat surface by a classic two-step electron transfer sequence accompanied by surface diffusion was carried out by a three-dimensional (3-D) kinetic Monte Carlo model linked to a 1-D (continuum) finite difference model. The evolution of deposit roughness was simulated numerically and compared, through use of scaling parameters, with experimental data obtained by atomic force microscopy from deposits formed under constant potential in aqueous solutions of 0.5 M Cu2SO4 and 1.0 M H2SO4. The model was used to carry out parametric investigations on the effect of adsorption, surface diffusion, and lattice incorporation, all of which were found to exert an influence on the evolution of surface roughness.

Original languageEnglish (US)
Pages (from-to)C396-C405
JournalJournal of the Electrochemical Society
Volume149
Issue number8
DOIs
StatePublished - Aug 2002

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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