Modeling of semiconductor substrate on on-chip power grid switching

Jae Yong Ihm, Andreas C Cangellaris

Research output: Contribution to conferencePaper

Abstract

A methodology is proposed and demonstrated for the modeling of the semiconductor substrate on on-chip power grid switching. A comprehensive electromagnetic model for the power grid, founded on the finite-difference approximation of Maxwell's curl equations, is combined with properly constructed, frequency-dependent equivalent surface impedance models for the doped semiconductor substrate to capture the impact of substrate loss on the grid response during switching. Numerical studies are utilized to illustrate the capabilities of the developed on-chip power grid solver.

Original languageEnglish (US)
Pages265-268
Number of pages4
StatePublished - Dec 1 2004
EventIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States
Duration: Oct 25 2004Oct 27 2004

Other

OtherIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
CountryUnited States
CityPortland, OR
Period10/25/0410/27/04

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Ihm, J. Y., & Cangellaris, A. C. (2004). Modeling of semiconductor substrate on on-chip power grid switching. 265-268. Paper presented at IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, United States.