Abstract
This paper presents an empirical approach to the modeling of fatigue in silicon MEMS structures. The approach is based on the regression analysis of stress-life data obtained from prior fatigue experiments on polysilicon and single crystal silicon. The possible directions for future modeling efforts are identified at the end of the paper, following a discussion on the implications of the current model fatigue life prediction.
Original language | English (US) |
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Pages (from-to) | 4157-4161 |
Number of pages | 5 |
Journal | Journal of Materials Science |
Volume | 38 |
Issue number | 20 |
DOIs | |
State | Published - Oct 15 2003 |
Externally published | Yes |
ASJC Scopus subject areas
- Mechanics of Materials
- Ceramics and Composites
- Mechanical Engineering
- Polymers and Plastics
- General Materials Science
- Materials Science (miscellaneous)