Modeling of Ag3Sn coarsening and its effect on creep in Sn-Ag-Cu solder

Xiaojing Wang, Qingsheng Zhu, Zhongguang Wang, Jianku Shang

Research output: Contribution to journalArticlepeer-review


Coarsening of the microstructure in Sn-Ag-Cu (SAC) solder joints under current stressing was observed experimentally and modeled by a dislocation-creep model which incorporates the coarsening of second phase particles in lead-free solder alloys. Both the effects of electric current and strain-enhanced coarsening were considered in this model. The straining effect took into account of both the inelastic-strain history and hydrostatic constraint. The model describes well the evolution of the eutectic microstructure and the predictions of the model agree reasonably well with experimentally observed trends.

Original languageEnglish (US)
Pages (from-to)912-918
Number of pages7
JournalJinshu Xuebao/ Acta Metallurgica Sinica
Issue number8
StatePublished - Aug 2009
Externally publishedYes


  • Electric current
  • Particle coarsening
  • Pb-free solder

ASJC Scopus subject areas

  • Geotechnical Engineering and Engineering Geology
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys


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