Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver

Jun Wei Wu; Jose E. Schutt-Aine; Zhi Guo Qian; Weng Cho Chew

doi:10.1109/EPEPS.2013.6703499

Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver

Jun Wei Wu, Jose E. Schutt-Aine, Zhi Guo Qian, Weng Cho Chew

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents a method to find the broadband equivalent circuit of multi-port interconnects with full wave electromagnetic solver. The interconnects are simulated by augmented electric field integral equation (A-EFIE). Stable and passive pole-residue model is generated by vector fitting and passivity enforcement. Multi-port equivalent circuit is synthesized from the pole-residue model, and can be easily incorporated into SPICE-like simulator for both frequency domain and time domain simulation. Numerical example is given to verify the method.

Original language	English (US)
Title of host publication	2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013
Publisher	IEEE Computer Society
Pages	203-206
Number of pages	4
ISBN (Print)	9781467325363
DOIs	https://doi.org/10.1109/EPEPS.2013.6703499
State	Published - 2013
Event	2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013 - San Jose, CA, United States Duration: Oct 27 2013 → Oct 30 2013

Publication series

Name	2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013

Other

Other	2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013
Country/Territory	United States
City	San Jose, CA
Period	10/27/13 → 10/30/13

ASJC Scopus subject areas

Electrical and Electronic Engineering

Online availability

10.1109/EPEPS.2013.6703499

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Wu, J. W., Schutt-Aine, J. E., Qian, Z. G., & Chew, W. C. (2013). Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver. In 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013 (pp. 203-206). Article 6703499 (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013). IEEE Computer Society. https://doi.org/10.1109/EPEPS.2013.6703499

Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver. / Wu, Jun Wei; Schutt-Aine, Jose E.; Qian, Zhi Guo et al.
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, 2013. p. 203-206 6703499 (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wu, JW, Schutt-Aine, JE, Qian, ZG & Chew, WC 2013, Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver. in 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013., 6703499, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013, IEEE Computer Society, pp. 203-206, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013, San Jose, CA, United States, 10/27/13. https://doi.org/10.1109/EPEPS.2013.6703499

Wu JW, Schutt-Aine JE, Qian ZG, Chew WC. Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver. In 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society. 2013. p. 203-206. 6703499. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013). doi: 10.1109/EPEPS.2013.6703499

Wu, Jun Wei ; Schutt-Aine, Jose E. ; Qian, Zhi Guo et al. / Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver. 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, 2013. pp. 203-206 (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

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abstract = "This paper presents a method to find the broadband equivalent circuit of multi-port interconnects with full wave electromagnetic solver. The interconnects are simulated by augmented electric field integral equation (A-EFIE). Stable and passive pole-residue model is generated by vector fitting and passivity enforcement. Multi-port equivalent circuit is synthesized from the pole-residue model, and can be easily incorporated into SPICE-like simulator for both frequency domain and time domain simulation. Numerical example is given to verify the method.",

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AB - This paper presents a method to find the broadband equivalent circuit of multi-port interconnects with full wave electromagnetic solver. The interconnects are simulated by augmented electric field integral equation (A-EFIE). Stable and passive pole-residue model is generated by vector fitting and passivity enforcement. Multi-port equivalent circuit is synthesized from the pole-residue model, and can be easily incorporated into SPICE-like simulator for both frequency domain and time domain simulation. Numerical example is given to verify the method.

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Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver

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