Modeling and simulation of coupled lossy lines for VLSI interconnections

O. A. Palusinski; A. C. Cangellaris; J. L. Prince; J. C. Liao; L. Vakanis

Modeling and simulation of coupled lossy lines for VLSI interconnections

O. A. Palusinski, A. C. Cangellaris, J. L. Prince, J. C. Liao, L. Vakanis

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The authors present techniques for the analysis of signal propagation in the interconnections used in VLSI systems. The propagation is modelled by coupled transmission lines which include losses. For conductors whose thickness is small compared to the skin depth over the principal spectrum of the pulse being propagated, the losses can be treated as frequency-independent; otherwise, the losses must be calculated as a function of frequency. It was observed that the inductance may be approximately treated as constant, but the resistance variations in frequency may be significant. A semianalytical method for computing the transients in lossy lines serves as the basis for the simulation of nonuniform lines.

Original language	English (US)
Title of host publication	1988 IEEE Int Conf Comput Des VLSI Comput Process ICCD 88 Proc
Publisher	Publ by IEEE
Pages	82-86
Number of pages	5
ISBN (Print)	0818608722
State	Published - 1988
Externally published	Yes

Publication series

Name	1988 IEEE Int Conf Comput Des VLSI Comput Process ICCD 88 Proc

ASJC Scopus subject areas

Engineering(all)

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Modeling and simulation of coupled lossy lines for VLSI interconnections. / Palusinski, O. A.; Cangellaris, A. C.; Prince, J. L. et al.

1988 IEEE Int Conf Comput Des VLSI Comput Process ICCD 88 Proc. Publ by IEEE, 1988. p. 82-86 (1988 IEEE Int Conf Comput Des VLSI Comput Process ICCD 88 Proc).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Palusinski, O. A.

AU - Cangellaris, A. C.

AU - Prince, J. L.

AU - Liao, J. C.

AU - Vakanis, L.

PY - 1988

Y1 - 1988

N2 - The authors present techniques for the analysis of signal propagation in the interconnections used in VLSI systems. The propagation is modelled by coupled transmission lines which include losses. For conductors whose thickness is small compared to the skin depth over the principal spectrum of the pulse being propagated, the losses can be treated as frequency-independent; otherwise, the losses must be calculated as a function of frequency. It was observed that the inductance may be approximately treated as constant, but the resistance variations in frequency may be significant. A semianalytical method for computing the transients in lossy lines serves as the basis for the simulation of nonuniform lines.

AB - The authors present techniques for the analysis of signal propagation in the interconnections used in VLSI systems. The propagation is modelled by coupled transmission lines which include losses. For conductors whose thickness is small compared to the skin depth over the principal spectrum of the pulse being propagated, the losses can be treated as frequency-independent; otherwise, the losses must be calculated as a function of frequency. It was observed that the inductance may be approximately treated as constant, but the resistance variations in frequency may be significant. A semianalytical method for computing the transients in lossy lines serves as the basis for the simulation of nonuniform lines.

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M3 - Conference contribution

AN - SCOPUS:0024136712

SN - 0818608722

T3 - 1988 IEEE Int Conf Comput Des VLSI Comput Process ICCD 88 Proc

SP - 82

EP - 86

BT - 1988 IEEE Int Conf Comput Des VLSI Comput Process ICCD 88 Proc

PB - Publ by IEEE

ER -

Modeling and simulation of coupled lossy lines for VLSI interconnections

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