MODELING AND PREDICTION OF SUB-MICROMETER HEAT TRANSFER DURING THERMOMECHANICAL DATA STORAGE

Keyphrases

• Cantilever 100%
• Heat Transfer 100%
• Sub-micrometer 100%
• Thermomechanical 100%
• Data Storage 100%
• Polymer Layer 66%
• Contact Diameter 66%
• Bit Size 66%
• Silicon Substrate 33%
• Temperature Distribution 33%
• Layer Thickness 33%
• Heat Flow 33%
• Temperature Rate 33%
• Polymer Interface 33%
• Polymer Coating 33%
• Radiation Loss 33%
• Phonon Scattering 33%
• Atomic Force Microscope Tips 33%
• Design Optimization 33%
• Atomic Force Microscope Cantilever 33%
• Tip Temperature 33%
• Substrate Interaction 33%
• Gas Conduction 33%
• Spatial Density 33%
• Conduction Losses 33%
• Writing Time 33%
• Heater Temperature 33%
• Data Writing 33%
• Ballistic Phonon Transport 33%
• Silicon Tips 33%
• Work Model 33%
• Heat Rate 33%
• Spatial Rate 33%

Material Science

• Silicon 100%
• Density 50%
• Polymer Coating 50%