MODELING AND PREDICTION OF SUB-MICROMETER HEAT TRANSFER DURING THERMOMECHANICAL DATA STORAGE

William P. King, Juan G. Santiago, Thomas W. Kenny, Kenneth E. Goodson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Heat transfer governs the bit size and writing rate during sub-micrometer thermomechanical data storage with Atomic Force Microscope (AFM) cantilevers. The present work predicts the temperature distribution and rates of heat flow in the AFM tip and the substrate as functions of the peak cantilever temperature, the diameter of the tip-substrate contact, and the thickness of the deforming polymer coating on the silicon substrate. The calculations consider increased phonon scattering, radiation losses, and gas conduction losses at the silicon tip boundaries. Nearly ballistic phonon transport in the tip augments the dependence of the heat rate into the polymer on the tip-polymer contact diameter. For a cantilever heater temperature of 700 K and a polymer layer thickness of 80 nm, the temperature at the tip-polymer interface is predicted for contact diameters from 4 nm to 50 nm. This work models the deformation of the polymer layer during data writing and predicts data bit size as a function of tip temperature and writing time. These simulations will help optimize the design of the cantilever and the polymer data layer, with the goal of increasing the spatial density and rate of bit formation.

Original languageEnglish (US)
Title of host publicationMicro-Electro-Mechanical Systems (MEMS)
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages583-588
Number of pages6
ISBN (Electronic)9780791816387
DOIs
StatePublished - 1999
Externally publishedYes
EventASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999 - Nashville, United States
Duration: Nov 14 1999Nov 19 1999

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume1999-W

Conference

ConferenceASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999
Country/TerritoryUnited States
CityNashville
Period11/14/9911/19/99

ASJC Scopus subject areas

  • Mechanical Engineering

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