TY - GEN
T1 - Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging
AU - Sun, Haofeng
AU - Shi, Bobi
AU - Nguyen, Thong
AU - Schutt-Ainé, José E.
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This study involves various routing layouts for chiplet-to-chiplet communication links based on the Bunch of Wires (BoW) standard, which are integrated within the 2.5D package. It encompasses multiple case studies examining single-layer and dual-layer routing configurations for both single and double BoW links. In the context of dual-layer routing, the study explores scenarios where decisions are made on which signal traces should share the same layer for routing. Additionally, it investigates the impact of adding a solid ground plane between the two routing layers. These analyses are particularly relevant given the varied bump pitches inherent in heterogeneous integration applications. The findings from these case studies are systematically presented and compared, with a focus on key eye diagram parameters.
AB - This study involves various routing layouts for chiplet-to-chiplet communication links based on the Bunch of Wires (BoW) standard, which are integrated within the 2.5D package. It encompasses multiple case studies examining single-layer and dual-layer routing configurations for both single and double BoW links. In the context of dual-layer routing, the study explores scenarios where decisions are made on which signal traces should share the same layer for routing. Additionally, it investigates the impact of adding a solid ground plane between the two routing layers. These analyses are particularly relevant given the varied bump pitches inherent in heterogeneous integration applications. The findings from these case studies are systematically presented and compared, with a focus on key eye diagram parameters.
UR - http://www.scopus.com/inward/record.url?scp=85197721838&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85197721838&partnerID=8YFLogxK
U2 - 10.1109/ECTC51529.2024.00173
DO - 10.1109/ECTC51529.2024.00173
M3 - Conference contribution
AN - SCOPUS:85197721838
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1078
EP - 1084
BT - Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 74th IEEE Electronic Components and Technology Conference, ECTC 2024
Y2 - 28 May 2024 through 31 May 2024
ER -