Modeling and Analysis for MOS Capacitance of TSV Considering Temperature Dependence

Qiu Min, Er Ping Li, Jian Ming Jin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint

Dive into the research topics of 'Modeling and Analysis for MOS Capacitance of TSV Considering Temperature Dependence'. Together they form a unique fingerprint.

INIS

Material Science

Engineering

Keyphrases