Modeling adhesive failure in electronic packages

Huck Beng Chew, T. F. Guo, L. Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The numerous pores and cavities present in adhesive underfills increase the susceptibility of microelectronic packages to Type II cracking. In this work, we focus on the effects of softening-rehardening and pressure-sensitivity on adhesive failure. An axisymmetric unit-cell study is first performed to ascertain the failure mechanisms in a softening-rehardening polymer. Results show that shear banding is the dominant failure mechanism under low stress triaxiality, while internal necking is the likely failure mode for highly constrained pressure-sensitive adhesives. With this in mind, a population of discrete voids is introduced ahead of a crack in an adhesive sandwiched between elastic substrates. We show that strain softening tends to lower the stress-carrying capacity of the adhesive, while strain rehardening suppresses both the intensity and spatial extent of damage. An increase in the rate of rehardening also reduces the oblacity of the voids. For adhesives with high pressure-sensitivity, rapid voiding occurs throughout the adhesive at low loads, leading to formation of extended damage zones.

Original languageEnglish (US)
Title of host publication2006 8th Electronics Packaging Technology Conference, EPTC
Pages787-792
Number of pages6
DOIs
StatePublished - Dec 1 2006
Externally publishedYes
Event2006 8th Electronics Packaging Technology Conference, EPTC - , Singapore
Duration: Dec 6 2006Dec 8 2006

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2006 8th Electronics Packaging Technology Conference, EPTC
Country/TerritorySingapore
Period12/6/0612/8/06

ASJC Scopus subject areas

  • Engineering(all)

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