Mode-I fracture toughness of tetrahedral amorphous diamond-like carbon (ta-C) MEMS

K. Jonnalagadda, S. W. Cho, I. Chasiotis, T. A. Friedmann, J. P. Sullivan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Mode-I fracture toughness studies were conducted on hydrogen-free tetrahedral amorphous diamond-like carbon (ta-C) MEMS specimens of various thicknesses. Mathematically sharp edge pre-cracks were generated through micro indentation on the Silicon dioxide sacrificial layer, An atomic force microscope (AFM) was employed to measure the precise length and orientation of each pre-crack. Upon wet etching and release the freestanding uniform width and varying thickness MEMS-scale specimens were tested in Mode-I using a cusiom-made micro-tensile tester, Fracture toughness values were computed from the test data using linear elastic fracture mechanics (LEFM) for a finite width specimen with an edge crack in the fixed grip loading configuration, The average Mode-I fracture toughness for 0,5 micron thick specimens was found to be 4.25±0.7 MPa√m while the average mode-I fracture toughness for 1 micron specimens was 4.4±0.4 MPa√m.

Original languageEnglish (US)
Title of host publicationStability of Thin Films and Nanostructures
Pages202-207
Number of pages6
StatePublished - Dec 1 2004
Externally publishedYes
Event2004 MRS Fall Meeting - Boston, MA, United States
Duration: Nov 28 2004Dec 3 2004

Publication series

NameMaterials Research Society Symposium Proceedings
Volume854
ISSN (Print)0272-9172

Other

Other2004 MRS Fall Meeting
CountryUnited States
CityBoston, MA
Period11/28/0412/3/04

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Jonnalagadda, K., Cho, S. W., Chasiotis, I., Friedmann, T. A., & Sullivan, J. P. (2004). Mode-I fracture toughness of tetrahedral amorphous diamond-like carbon (ta-C) MEMS. In Stability of Thin Films and Nanostructures (pp. 202-207). (Materials Research Society Symposium Proceedings; Vol. 854).