Mixed-mode failure of thin films using laser-generated shear waves

Research output: Contribution to journalArticlepeer-review


A new test method is developed for studying mixed-mode interfacial failure of thin films using laser generated stress waves. Guided by recent parametric studies of laser-induced tensile spallation, we successfully extend this technique to achieve mixed-mode loading conditions. By allowing an initial longitudinal wave to mode convert at an oblique surface, a high amplitude shear wave is generated in a fused silica substrate and propagated toward the thin-film surface. A shear wave is obtained with amplitude large enough to fail an Al film/fused silica interface and the corresponding shear stress calculated from high-speed interferometric displacement measurements. Examination of the interfaces failed under mixed-mode conditions reveals significant wrinkling and tearing of the film, in great contrast to blister patterns observed in similar Al films failed under tensile loading.

Original languageEnglish (US)
Pages (from-to)323-330
Number of pages8
JournalExperimental Mechanics
Issue number3
StatePublished - Sep 2003


  • Film failure
  • Interfacial adhesion
  • Mixed-mode
  • Mode conversion
  • Pulsing laser
  • Shear wave

ASJC Scopus subject areas

  • Mechanics of Materials
  • Computational Mechanics

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