@inproceedings{7e2e50c69bf8447bb0445eb8e1d27a5c,
title = "MiLTOn: Sensing Product Integrity without Opening the Box using Non-Invasive Acoustic Vibrometry",
abstract = "This paper asks: 'Can we detect whether a fragile product, made of porcelain or glass is damaged as it travels along the supply chain, without opening its packaging?' We ask this question in the context of the multi-billion dollar global supply chain industry of fragile products that experience large overheads due to product returns. This paper presents MiLTOn, a novel acoustic and mm-wave based solution for through-box non-invasive product integrity sensing that is sensitive to even minute sub-mm cracks in the object. MiLTOn is inspired by acoustic vibrometry used for instance to monitor cracks in railroads. Unlike traditional vibrometry, MiL-TOn is unique in its ability to sense products non-invasively using an external transducer and microphone, neither of which are in direct physical contact of the object within the box. MiLTOn pro-cesses measurements from the microphone to design a robust and environment-independent product signature that can be used to sense presence of product defects. Our extensive evaluation on a large number of fragile products of diverse materials demonstrates 97% accuracy in identifying product damage.",
keywords = "Acoustic Vibrometry, Supply Chain, damage identification, multimodal sensing",
author = "Akshay Gadre and Deepak Vasisht and Nikunj Raghuvanshi and Bodhi Priyantha and Manikanta Kotaru and Swarun Kumar and Ranveer Chandra",
note = "Funding Information: We thank our shepherd and the anonymous reviewers for their valuable feedback and insights. We thank our colleagues at Microsoft Research for Industry and WiTech Lab for their constructive inputs and help. This research was done at Microsoft. Akshay was supported in part by NSF (awards 2106921, 2030154, 2007786, 1942902). Publisher Copyright: {\textcopyright} 2022 IEEE.; 21st ACM/IEEE International Conference on Information Processing in Sensor Networks, IPSN 2022 ; Conference date: 04-05-2022 Through 06-05-2022",
year = "2022",
doi = "10.1109/IPSN54338.2022.00038",
language = "English (US)",
series = "Proceedings - 21st ACM/IEEE International Conference on Information Processing in Sensor Networks, IPSN 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "390--402",
booktitle = "Proceedings - 21st ACM/IEEE International Conference on Information Processing in Sensor Networks, IPSN 2022",
address = "United States",
}