TY - GEN
T1 - Millimeter-Wave Propagation within a Computer Chip Package
AU - Timoneda, Xavier
AU - Abadal, Sergi
AU - Cabellos-Aparicio, Albert
AU - Manessis, Dionysios
AU - Zhou, Jin
AU - Franques, Antonio
AU - Torrellas, Josep
AU - Alarcon, Eduard
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/26
Y1 - 2018/4/26
N2 - Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modeling a flip-chip package and investigating the wave propagation inside it. Through parametric studies, a locally optimal configuration for 60 GHz WNoC is obtained, showing that chip-wide attenuation below 32.6 dB could be achieved with standard processes. Finally, the applicability of the methodology is discussed for higher bands and other integrated environments such as a Software-Defined Metamaterial (SDM).
AB - Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modeling a flip-chip package and investigating the wave propagation inside it. Through parametric studies, a locally optimal configuration for 60 GHz WNoC is obtained, showing that chip-wide attenuation below 32.6 dB could be achieved with standard processes. Finally, the applicability of the methodology is discussed for higher bands and other integrated environments such as a Software-Defined Metamaterial (SDM).
UR - http://www.scopus.com/inward/record.url?scp=85057092212&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85057092212&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2018.8351875
DO - 10.1109/ISCAS.2018.8351875
M3 - Conference contribution
AN - SCOPUS:85057092212
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
BT - 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018
Y2 - 27 May 2018 through 30 May 2018
ER -