Millimeter-Wave Propagation within a Computer Chip Package

Xavier Timoneda, Sergi Abadal, Albert Cabellos-Aparicio, Dionysios Manessis, Jin Zhou, Antonio Franques, Josep Torrellas, Eduard Alarcon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modeling a flip-chip package and investigating the wave propagation inside it. Through parametric studies, a locally optimal configuration for 60 GHz WNoC is obtained, showing that chip-wide attenuation below 32.6 dB could be achieved with standard processes. Finally, the applicability of the methodology is discussed for higher bands and other integrated environments such as a Software-Defined Metamaterial (SDM).

Original languageEnglish (US)
Title of host publication2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538648810
DOIs
StatePublished - Apr 26 2018
Externally publishedYes
Event2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 - Florence, Italy
Duration: May 27 2018May 30 2018

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
Volume2018-May
ISSN (Print)0271-4310

Other

Other2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018
Country/TerritoryItaly
CityFlorence
Period5/27/185/30/18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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