Microtensile tests with the aid of probe microscopy for the study of MEMS materials

Ioannis Chasiotis, Wolfgang G. Knauss

Research output: Contribution to journalConference articlepeer-review


Mechanical tests of thin films require novel and sophisticated methods that can address the geometry and microstructure of the films. A new method of micro-tensile testing of MicroElectroMechanical Systems (MEMS) films has been demonstrated. An improved apparatus has been designed and implemented to measure the elastic tensile properties (Young's modulus, Poisson's ratio and tensile strength) of surface micromachined polysilicon specimens. The tensile specimens are `dog-bone' shaped ending in a large `paddle' for convenient electrostatic or, in the improved apparatus, UV adhesive gripping. The test section of the specimens is 400 μm long with 2 μm×50 μm cross section. The method employs Atomic Force Microscope (AFM) acquired surface topologies of deforming specimens to determine (fields of) strains by way of the Digital Image Correlation method (DIC). With this method, high strength or non-linearly behaving materials under different environmental conditions can be tested by measuring the strains directly on the surface of the film with nanometer resolution in in-plane and out-of-plane measurements.

Original languageEnglish (US)
Pages (from-to)96-103
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
StatePublished - 2000
Externally publishedYes
EventMterials and Devices Characterization in Micromachining III - Santa Clara, CA, USA
Duration: Sep 18 2000Sep 19 2000

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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