Microsystems manufacturing via embossing of thermally sacrificial polymers

Clifford L. Henderson, William P. King, Celesta E. White, Harry R. Rowland

Research output: Contribution to journalConference articlepeer-review


This paper reports a novel method for manufacturing three-dimensional microstructures that can contain buried microchannels, freely standing structures, and/or be fully released from a substrate. The method involves embossing photodefinable thermally sacrificial polymers that are subsequently overcoated with another permanent structural material (e.g. glasses, polymer, etc.) and then decomposed by heating at elevated temperatures. This heating step results in the decomposition of the sacrificial material into gaseous products, thus opening or releasing the desired structures. This paper discusses such a process using a negative tone photosensitive polynorbornene sacrificial polymer and deomstrates the fabrication of a microfluidic device using the method.

Original languageEnglish (US)
Article numberM2.8
Pages (from-to)17-20
Number of pages4
JournalMaterials Research Society Symposium Proceedings
Issue number2
StatePublished - 2004
Externally publishedYes
Event2003 MRS Fall Meeting - Boston, MA, United States
Duration: Dec 1 2003Dec 5 2003

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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