Microsystems manufacturing via embossing of photodefinable thermally sacrificial materials

Celesta E. White, Travis Anderson, Clifford L. Henderson, Harry D. Rowland, William P. King

Research output: Contribution to journalConference articlepeer-review


A method of manufacturing three-dimensional microstructures using embossing based lithography of photodefinable thermally sacrificial materials is described. The sacrificial polymers can be cleanly decomposed to gaseous products upon heating at elevated temperatures. The sacrificial polymers are directly embossed and subsequently overcoated with a variety of materials including other polymers, dielectrics, semiconductors and metals. Finally, the entire structure is heated to the decomposition temperature of the sacrificial polymer which results in the dry removal of the sacrificial layer, thus releasing the desired structures.

Original languageEnglish (US)
Pages (from-to)361-370
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Issue numberPART 1
StatePublished - 2004
Externally publishedYes
EventEmerging Lithographic Technologies VIII - Santa Clara, CA, United States
Duration: Feb 24 2004Feb 26 2004


  • Embossing
  • Imprint lithography
  • MEMS
  • Microfluidic system
  • Polynorbornene
  • Sacrificial polymer

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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