Abstract
The relationship between microstructure and fatigue resistance of solder interfaces was studied by examining micromechanisms and micromechanics of fatigue crack growth along a series of model interfaces. While the fatigue crack was seen to prepare staying in the solder when propagating at high rates, interfacial crack sliding was predominant in the near-threshold regime. A micromechanical model of interfacial crack is also developed based on interface fracture mechanics concept.
| Original language | English (US) |
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| Number of pages | 1 |
| State | Published - 1998 |
| Event | Proceedings of the 1998 5th International Conference on Solid-State and Integrated Circuit Technology - Beijing, China Duration: Oct 21 1998 → Oct 23 1998 |
Conference
| Conference | Proceedings of the 1998 5th International Conference on Solid-State and Integrated Circuit Technology |
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| City | Beijing, China |
| Period | 10/21/98 → 10/23/98 |
ASJC Scopus subject areas
- Engineering(all)