Microstructure and fatigue resistance of solder interfaces

Jian Ku Shang, Daping Yao, Chunsheng Zhang

Research output: Contribution to conferencePaper

Abstract

The relationship between microstructure and fatigue resistance of solder interfaces was studied by examining micromechanisms and micromechanics of fatigue crack growth along a series of model interfaces. While the fatigue crack was seen to prepare staying in the solder when propagating at high rates, interfacial crack sliding was predominant in the near-threshold regime. A micromechanical model of interfacial crack is also developed based on interface fracture mechanics concept.

Original languageEnglish (US)
Number of pages1
StatePublished - Dec 1 1998
EventProceedings of the 1998 5th International Conference on Solid-State and Integrated Circuit Technology - Beijing, China
Duration: Oct 21 1998Oct 23 1998

Conference

ConferenceProceedings of the 1998 5th International Conference on Solid-State and Integrated Circuit Technology
CityBeijing, China
Period10/21/9810/23/98

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Shang, J. K., Yao, D., & Zhang, C. (1998). Microstructure and fatigue resistance of solder interfaces. Paper presented at Proceedings of the 1998 5th International Conference on Solid-State and Integrated Circuit Technology, Beijing, China, .