TY - GEN
T1 - Microstructural investigation on the interfacial evolution of SnBi/Cu interconnect during reflow and solid-state aging
AU - Liu, Zhi Quan
AU - Shang, Pan Ju
AU - Pang, Xue Yong
AU - Shang, Jian Ku
PY - 2008
Y1 - 2008
N2 - The microstructures of SnBi/Cu interconnect after reflow and its evolution during solid-state aging at 393K were investigated using transmission electron microscopy (TEM). It was found that after reflow there were two kinds of intermetallic compounds (IMCs) - Cu6Sn5 and Cu 3Sn in solder joint. Above these IMC layers there was a Bi-rich layer which consisted of discontinuous Bi particles. During solid state aging, the Cu3Sn phase grew faster into Cu substrate than into Cu 6Sn5, and the Bi-rich layer did not change much. However, new Bi particles were observed at the Cu3Sn/Cu interface, which introduced interfacial voids around Bi particles. First principles calculation revealed that Bi segregation reduced the adhesion energy of Cu/Cu3Sn interface and caused serious reliability problem.
AB - The microstructures of SnBi/Cu interconnect after reflow and its evolution during solid-state aging at 393K were investigated using transmission electron microscopy (TEM). It was found that after reflow there were two kinds of intermetallic compounds (IMCs) - Cu6Sn5 and Cu 3Sn in solder joint. Above these IMC layers there was a Bi-rich layer which consisted of discontinuous Bi particles. During solid state aging, the Cu3Sn phase grew faster into Cu substrate than into Cu 6Sn5, and the Bi-rich layer did not change much. However, new Bi particles were observed at the Cu3Sn/Cu interface, which introduced interfacial voids around Bi particles. First principles calculation revealed that Bi segregation reduced the adhesion energy of Cu/Cu3Sn interface and caused serious reliability problem.
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U2 - 10.1109/ICEPT.2008.4607072
DO - 10.1109/ICEPT.2008.4607072
M3 - Conference contribution
AN - SCOPUS:52449115657
SN - 9781424427406
T3 - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
BT - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
T2 - 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Y2 - 28 July 2008 through 31 July 2008
ER -