Microscale stamp with reversible adhesion for transfer printing

Seok Kim (Inventor), Jeffrey D Eisenhaure (Inventor)

Research output: Patent

Abstract

A microscale stamp for transfer printing includes (a) a stamp body comprising a shape memory polymer having a glass transition temperature (Tg) and (b) one or more protruding structures attached to a surface of the stamp body. The shape memory polymer comprises a deformable state at temperatures above Tg and a rigid state at temperatures below Tg. The one or more protruding structures comprise a material which is different from the shape memory polymer and which has a Young's modulus greater than a storage modulus of the shape memory polymer.
Original languageEnglish (US)
U.S. patent number10046353
Filing date6/5/15
StatePublished - Aug 14 2018

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