Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill

J. E. Park; Iwona M Jasiuk; A. Zubelewicz

Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill

J. E. Park, Iwona M Jasiuk, A. Zubelewicz

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The flip-chip assembly, which is made of three main components: chip with C4 interconnects, underfill and substrate, undergoes thermal loadings during a curing process and its operational life. This analysis is focused on the delamination of the underfill from the passivation layer of a chip due to a thermal loading by using a simple model involving a finite bi-material strip. The underfill is modeled as a composite material consisting of the polymer matrix and silica particles. The interfacial stresses are determined here for several particle arrangements, while the interfacial fracture is studied using a J-integral method. The interfacial stress analysis and the J-integral method give the same trends.

Original language	English (US)
Title of host publication	Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Pages	240-245
Number of pages	6
State	Published - 2001
Externally published	Yes
Event	International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, United States Duration: Mar 11 2001 → Mar 14 2001

Other

Other	International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Country/Territory	United States
City	Braselton, GA
Period	3/11/01 → 3/14/01

ASJC Scopus subject areas

General Engineering
General Materials Science

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Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill. / Park, J. E.; Jasiuk, Iwona M; Zubelewicz, A.
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. 2001. p. 240-245.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Park, JE, Jasiuk, IM & Zubelewicz, A 2001, Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill. in Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces. pp. 240-245, International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, United States, 3/11/01.

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AB - The flip-chip assembly, which is made of three main components: chip with C4 interconnects, underfill and substrate, undergoes thermal loadings during a curing process and its operational life. This analysis is focused on the delamination of the underfill from the passivation layer of a chip due to a thermal loading by using a simple model involving a finite bi-material strip. The underfill is modeled as a composite material consisting of the polymer matrix and silica particles. The interfacial stresses are determined here for several particle arrangements, while the interfacial fracture is studied using a J-integral method. The interfacial stress analysis and the J-integral method give the same trends.

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BT - Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

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ER -

Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill

Abstract

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ASJC Scopus subject areas

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