Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill

J. E. Park, Iwona M Jasiuk, A. Zubelewicz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The flip-chip assembly, which is made of three main components: chip with C4 interconnects, underfill and substrate, undergoes thermal loadings during a curing process and its operational life. This analysis is focused on the delamination of the underfill from the passivation layer of a chip due to a thermal loading by using a simple model involving a finite bi-material strip. The underfill is modeled as a composite material consisting of the polymer matrix and silica particles. The interfacial stresses are determined here for several particle arrangements, while the interfacial fracture is studied using a J-integral method. The interfacial stress analysis and the J-integral method give the same trends.

Original languageEnglish (US)
Title of host publicationProceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Pages240-245
Number of pages6
StatePublished - 2001
Externally publishedYes
EventInternational Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, United States
Duration: Mar 11 2001Mar 14 2001

Other

OtherInternational Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
CountryUnited States
CityBraselton, GA
Period3/11/013/14/01

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

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