Micromechanics-based interfacial debonding model of functionally graded materials

G. H. Paulino, H. M. Yin, L. Z. Sun

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study develops a micromechanical damage model for two-phase functionally graded materials considering the interfacial debonding of particles and pair-wise interactions between particles. Given an applied mechanical loading, in the particle-matrix zones, the interactions from all other particles over the representative volume element are integrated to calculate the homogenized elastic fields. The progressive damage process is dependent on the applied loading and is represented by the debonding angles which are obtained from the relation between the particle stress and the interfacial strength. In terms of the elastic equivalency, the debonded, isotropic particles are replaced by the perfectly bonded, orthotropic particles. The effective elasticity distribution in the gradation direction is correspondingly solved. Numerical simulations are implemented to illustrate the capability of the proposed model.

Original languageEnglish (US)
Title of host publicationMultiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX
Pages802-807
Number of pages6
DOIs
StatePublished - Mar 13 2008
Event9th International Conference on Multiscale and Functionally Graded Materials, FGM IX - Oahu Island, HI, United States
Duration: Oct 15 2006Oct 18 2006

Publication series

NameAIP Conference Proceedings
Volume973
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

Other9th International Conference on Multiscale and Functionally Graded Materials, FGM IX
CountryUnited States
CityOahu Island, HI
Period10/15/0610/18/06

Keywords

  • Damage mechanics
  • Effective elasticity
  • Functionally graded composites
  • Interfacial debonding
  • Micromechanical modeling

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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  • Cite this

    Paulino, G. H., Yin, H. M., & Sun, L. Z. (2008). Micromechanics-based interfacial debonding model of functionally graded materials. In Multiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX (pp. 802-807). (AIP Conference Proceedings; Vol. 973). https://doi.org/10.1063/1.2896884