Microfluidic systems and components

Kee Ryu; Chang Liu; Kashan Shaikh; David A Bullen; Edgar D Goluch; Zhifang Fan

Microfluidic systems and components

Kee Ryu (Inventor), Chang Liu (Inventor), Kashan Shaikh (Inventor), David A Bullen (Inventor), Edgar D Goluch (Inventor), Zhifang Fan (Inventor)

Research output: Patent

Abstract

Microfluidic systems and components. A microfluidic system includes one or more functional units or microfluidic chips, configured to perform constituent steps in a process and interconnected to form the system. A multi-layer microfluidic system includes a separate dedicated fluid layer and dedicated electromechanical layer connected via through-holes. Electromechanical components are formed on the electromechanical layer.

Original language	English (US)
U.S. patent number	7351303
Filing date	10/9/03
State	Published - Apr 1 2008

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title = "Microfluidic systems and components",

abstract = "Microfluidic systems and components. A microfluidic system includes one or more functional units or microfluidic chips, configured to perform constituent steps in a process and interconnected to form the system. A multi-layer microfluidic system includes a separate dedicated fluid layer and dedicated electromechanical layer connected via through-holes. Electromechanical components are formed on the electromechanical layer.",

author = "Kee Ryu and Chang Liu and Kashan Shaikh and Bullen, {David A} and Goluch, {Edgar D} and Zhifang Fan",

note = "STATEMENT OF GOVERNMENT INTEREST This invention was made with Government assistance under National Science Foundation (NSF) Contract Number 0830520, and under Air Force Office of Scientific Research (AFOSR) Contract Number F49620-01-1-0401. The Government has certain rights in this invention.; 7351303",

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AU - Ryu, Kee

AU - Liu, Chang

AU - Shaikh, Kashan

AU - Bullen, David A

AU - Goluch, Edgar D

AU - Fan, Zhifang

N1 - STATEMENT OF GOVERNMENT INTEREST This invention was made with Government assistance under National Science Foundation (NSF) Contract Number 0830520, and under Air Force Office of Scientific Research (AFOSR) Contract Number F49620-01-1-0401. The Government has certain rights in this invention.

PY - 2008/4/1

Y1 - 2008/4/1

N2 - Microfluidic systems and components. A microfluidic system includes one or more functional units or microfluidic chips, configured to perform constituent steps in a process and interconnected to form the system. A multi-layer microfluidic system includes a separate dedicated fluid layer and dedicated electromechanical layer connected via through-holes. Electromechanical components are formed on the electromechanical layer.

AB - Microfluidic systems and components. A microfluidic system includes one or more functional units or microfluidic chips, configured to perform constituent steps in a process and interconnected to form the system. A multi-layer microfluidic system includes a separate dedicated fluid layer and dedicated electromechanical layer connected via through-holes. Electromechanical components are formed on the electromechanical layer.

M3 - Patent

M1 - 7351303

Y2 - 2003/10/09

ER -

Microfluidic systems and components

Abstract

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