Microfabricated pressure and shear stress sensors

Jonathan Engel; Nannan I Chen; Jack Chen; Chang Liu

Microfabricated pressure and shear stress sensors

Jonathan Engel (Inventor), Nannan I Chen (Inventor), Jack Chen (Inventor), Chang Liu (Inventor)

Research output: Patent

Abstract

A microfabricated pressure sensor. The pressure sensor comprises a raised diaphragm disposed on a substrate. The diaphragm is configured to bend in response to an applied pressure difference. A strain gauge of a conductive material is coupled to a surface of the raised diaphragm and to at least one of the substrate and a piece rigidly connected to the substrate.

Original language	English (US)
U.S. patent number	7509869
Filing date	7/20/07
State	Published - Mar 31 2009

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title = "Microfabricated pressure and shear stress sensors",

abstract = "A microfabricated pressure sensor. The pressure sensor comprises a raised diaphragm disposed on a substrate. The diaphragm is configured to bend in response to an applied pressure difference. A strain gauge of a conductive material is coupled to a surface of the raised diaphragm and to at least one of the substrate and a piece rigidly connected to the substrate.",

author = "Jonathan Engel and Chen, {Nannan I} and Jack Chen and Chang Liu",

note = "STATEMENT OF GOVERNMENT INTEREST The invention was made with Government assistance under NSF Grant Nos. IIS-00-80639 and IIS-99-84954, AFOSR Grant F49620-01-1-0496, and NASA Grant No. NAG5-8781. The Government has certain rights in the invention.; 7509869",

year = "2009",

month = mar,

day = "31",

language = "English (US)",

type = "Patent",

}

TY - PAT

T1 - Microfabricated pressure and shear stress sensors

AU - Engel, Jonathan

AU - Chen, Nannan I

AU - Chen, Jack

AU - Liu, Chang

N1 - STATEMENT OF GOVERNMENT INTEREST The invention was made with Government assistance under NSF Grant Nos. IIS-00-80639 and IIS-99-84954, AFOSR Grant F49620-01-1-0496, and NASA Grant No. NAG5-8781. The Government has certain rights in the invention.

PY - 2009/3/31

Y1 - 2009/3/31

N2 - A microfabricated pressure sensor. The pressure sensor comprises a raised diaphragm disposed on a substrate. The diaphragm is configured to bend in response to an applied pressure difference. A strain gauge of a conductive material is coupled to a surface of the raised diaphragm and to at least one of the substrate and a piece rigidly connected to the substrate.

AB - A microfabricated pressure sensor. The pressure sensor comprises a raised diaphragm disposed on a substrate. The diaphragm is configured to bend in response to an applied pressure difference. A strain gauge of a conductive material is coupled to a surface of the raised diaphragm and to at least one of the substrate and a piece rigidly connected to the substrate.

M3 - Patent

M1 - 7509869

Y2 - 2007/07/20

ER -

Microfabricated pressure and shear stress sensors

Abstract

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