Microelectronic film thickness determination using a laser-based ultrasonic technique

R. Logan, A. A. Maznev, K. A. Nelson, J. A. Rogers, M. Fuchs, M. Banet

Research output: Contribution to journalArticle

Abstract

A non-contact and non-destructive laser-based acoustic technique called impulsive stimulated thermal scattering (ISTS) is used to measure thicknesses of films in single-layer and multilayer assemblies such as W/Si, Ti/Si, and Ti/SiO2/Si structures. Thicknesses are determined to within a few percent accuracy with a laboratory version of the measurement apparatus, using conventional large-frame lasers and optics, and in a commercial prototype using compact diode-pumped and diode lasers and optics which all fit onto a 1-ft×2-ft breadboard. ISTS and conventional measurements (profilometry, SEM, and 4-point resistance) are made on the same samples and the results are found to compare favorably.

Original languageEnglish (US)
Pages (from-to)347-352
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume440
StatePublished - 1997

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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    Logan, R., Maznev, A. A., Nelson, K. A., Rogers, J. A., Fuchs, M., & Banet, M. (1997). Microelectronic film thickness determination using a laser-based ultrasonic technique. Materials Research Society Symposium - Proceedings, 440, 347-352.