TY - GEN
T1 - Microcantilever system incorporating internal resonance for multi-harmonic atomic force microscopy
AU - Pettit, Chris
AU - Jeong, Bongwon
AU - Keum, Hohyun
AU - Lee, Joohyung
AU - Kim, Jungkyu
AU - Kim, Seok
AU - McFarland, Donald Michael
AU - Bergman, Lawreence A.
AU - Vakakis, Alexander F.
AU - Cho, Hanna
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/2/26
Y1 - 2015/2/26
N2 - We report a new design concept of micromechanical cantilever system incorporating the 1/3 internal resonance during dynamic mode operation of atomic force microscopy (AFM). The passive amplification of third harmonic triggered through the mechanism of 1/3 internal resonance enables AFM to utilize multiple harmonics in an air environment. Detailed theoretical and experimental studies of the proposed design demonstrate that the multi-harmonic AFM (MH-AFM) is capable of simultaneous topography imaging and compositional mapping with more than 10-fold enhanced sensitivity.
AB - We report a new design concept of micromechanical cantilever system incorporating the 1/3 internal resonance during dynamic mode operation of atomic force microscopy (AFM). The passive amplification of third harmonic triggered through the mechanism of 1/3 internal resonance enables AFM to utilize multiple harmonics in an air environment. Detailed theoretical and experimental studies of the proposed design demonstrate that the multi-harmonic AFM (MH-AFM) is capable of simultaneous topography imaging and compositional mapping with more than 10-fold enhanced sensitivity.
UR - http://www.scopus.com/inward/record.url?scp=84931065359&partnerID=8YFLogxK
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U2 - 10.1109/MEMSYS.2015.7051067
DO - 10.1109/MEMSYS.2015.7051067
M3 - Conference contribution
AN - SCOPUS:84931065359
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 752
EP - 755
BT - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
Y2 - 18 January 2015 through 22 January 2015
ER -