Microassembly of MEMS actuators and sensors via micro-masonry

Y. Zhang, H. Keum, S. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Micro-masonry is a microassembly technique that is based on transfer printing and direct bonding. This paper presents the assembly of MEMS mechanical sensors and actuators based on this micro-masonry technique. Microfabrication processes for retrievable MEMS components (e.g., combs, flexure beams, and metal pads) are developed. As manipulation tools, elastomeric microtipped stamps with switchable dry adhesion are also designed and fabricated to pick up and place those components. After the assembly, the components are permanently bonded together via rapid thermal annealing. The sensing and actuating capabilities of the assembled MEMS devices are characterized.

Original languageEnglish (US)
Title of host publicationIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Pages283-286
Number of pages4
DOIs
StatePublished - 2013
EventIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan, Province of China
Duration: Jan 20 2013Jan 24 2013

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

OtherIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Country/TerritoryTaiwan, Province of China
CityTaipei
Period1/20/131/24/13

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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