TY - GEN
T1 - Microassembly of MEMS actuators and sensors via micro-masonry
AU - Zhang, Y.
AU - Keum, H.
AU - Kim, S.
PY - 2013
Y1 - 2013
N2 - Micro-masonry is a microassembly technique that is based on transfer printing and direct bonding. This paper presents the assembly of MEMS mechanical sensors and actuators based on this micro-masonry technique. Microfabrication processes for retrievable MEMS components (e.g., combs, flexure beams, and metal pads) are developed. As manipulation tools, elastomeric microtipped stamps with switchable dry adhesion are also designed and fabricated to pick up and place those components. After the assembly, the components are permanently bonded together via rapid thermal annealing. The sensing and actuating capabilities of the assembled MEMS devices are characterized.
AB - Micro-masonry is a microassembly technique that is based on transfer printing and direct bonding. This paper presents the assembly of MEMS mechanical sensors and actuators based on this micro-masonry technique. Microfabrication processes for retrievable MEMS components (e.g., combs, flexure beams, and metal pads) are developed. As manipulation tools, elastomeric microtipped stamps with switchable dry adhesion are also designed and fabricated to pick up and place those components. After the assembly, the components are permanently bonded together via rapid thermal annealing. The sensing and actuating capabilities of the assembled MEMS devices are characterized.
UR - http://www.scopus.com/inward/record.url?scp=84875466426&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84875466426&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2013.6474233
DO - 10.1109/MEMSYS.2013.6474233
M3 - Conference contribution
AN - SCOPUS:84875466426
SN - 9781467356558
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 283
EP - 286
BT - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
T2 - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Y2 - 20 January 2013 through 24 January 2013
ER -