Microassembly of heterogeneous materials using transfer printing and thermal processing

Keyphrases

• Transfer Printing 100%
• Microsystems 100%
• Heterogeneous Materials 100%
• Microassembly 100%
• Thermal Processing 100%
• Photonics 33%
• Resonator 33%
• Microfabrication 33%
• Heterogeneous Material Integration 33%
• Radio Frequency Microelectromechanical Systems (RF MEMS) 33%
• Device Level 33%
• Organic Semiconductors 33%
• Structural Integrity 33%
• Metal-polymer 33%
• Applications in Electronics 33%
• System Switching 33%
• Reversible Adhesion 33%
• Dissimilar Materials 33%
• Surface Adhesion 33%
• Mechanical Motion 33%
• Metal-dielectric 33%
• Joining Mechanism 33%
• Blister Test 33%
• Including Semiconductors 33%
• Electrical Function 33%
• Material Joining 33%
• Microtoroid 33%

Engineering

• Microscale 100%
• Microsystem 100%
• Thermal Processing 100%
• Photonics 33%
• Microelectromechanical System 33%
• Resonator 33%
• Microfabrication 33%
• Radio Frequency 33%
• Dielectrics 33%
• Building Block 33%
• Structural Integrity 33%
• Material Grade 33%

Material Science

• Heterogeneous Material 100%
• Microelectromechanical System 33%
• Dielectric Material 33%
• Resonator 33%
• Microfabrication 33%