Micro mechanical single crystal silicon fracture studies - torsion and bending

M Taher A Saif, N. C. MacDonald

Research output: Contribution to conferencePaperpeer-review

Abstract

We introduce a micro electro mechanical system to characterize materials as their size is reduced to submicron scale. We employ the system to study the strength of a single crystal silicon pillar subjected to twisting and bending. The minimum width of the pillar is .5 μm. Its length is less than 10 μm. It twists by more than 20° before failure. The maximum normal and shear stress at failure are estimated to be 20 GPa and 8.5 GPa respectively.

Original languageEnglish (US)
Pages105-109
Number of pages5
StatePublished - Jan 1 1996
Externally publishedYes
EventProceedings of the 1995 9th Annual International Workshop on Micro Electro Mechanical Systems - San Diego, CA, USA
Duration: Feb 11 1996Feb 15 1996

Other

OtherProceedings of the 1995 9th Annual International Workshop on Micro Electro Mechanical Systems
CitySan Diego, CA, USA
Period2/11/962/15/96

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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