Abstract
We introduce a micro electro mechanical system to characterize materials as their size is reduced to submicron scale. We employ the system to study the strength of a single crystal silicon pillar subjected to twisting and bending. The minimum width of the pillar is .5 μm. Its length is less than 10 μm. It twists by more than 20° before failure. The maximum normal and shear stress at failure are estimated to be 20 GPa and 8.5 GPa respectively.
| Original language | English (US) |
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| Pages | 105-109 |
| Number of pages | 5 |
| State | Published - 1996 |
| Externally published | Yes |
| Event | Proceedings of the 1995 9th Annual International Workshop on Micro Electro Mechanical Systems - San Diego, CA, USA Duration: Feb 11 1996 → Feb 15 1996 |
Other
| Other | Proceedings of the 1995 9th Annual International Workshop on Micro Electro Mechanical Systems |
|---|---|
| City | San Diego, CA, USA |
| Period | 2/11/96 → 2/15/96 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Mechanical Engineering
- Electrical and Electronic Engineering