| Original language | English (US) |
|---|---|
| U.S. patent number | 12025913 |
| State | Published - Jul 2 2024 |
Methods Of Making A Bonded Assembly And A Re-entrant Structure, And Method Of Transfer Printing A Masking Layer
Seok Kim (Inventor), Hohyun Keum (Inventor), Jun Kyu Park (Inventor)
Research output: Patent