Methods of forming power electronic assemblies using metal inverse opals and cap structures

Shailesh Joshi; Naoya Taki; Paul V Braun; Julia B Kohanek; Gaurav S Singhal

Methods of forming power electronic assemblies using metal inverse opals and cap structures

Shailesh Joshi (Inventor), Naoya Taki (Inventor), Paul V Braun (Inventor), Julia B Kohanek (Inventor), Gaurav S Singhal (Inventor)

Research output: Patent

Abstract

Methods for forming bonded assemblies using metal inverse opal and cap structures are disclosed. In one embodiment, a method for forming a bonded assembly includes positioning a substrate against a polymer support that is porous, depositing a metal onto and within the polymer support, disposing a cap layer to the polymer support opposite of the substrate to form a bottom electrode, and removing the polymer support from between the substrate and the cap layer to form a metal inverse opal structure disposed therebetween.

Original language	English (US)
U.S. patent number	10818576
State	Published - Oct 27 2020

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title = "Methods of forming power electronic assemblies using metal inverse opals and cap structures",

abstract = "Methods for forming bonded assemblies using metal inverse opal and cap structures are disclosed. In one embodiment, a method for forming a bonded assembly includes positioning a substrate against a polymer support that is porous, depositing a metal onto and within the polymer support, disposing a cap layer to the polymer support opposite of the substrate to form a bottom electrode, and removing the polymer support from between the substrate and the cap layer to form a metal inverse opal structure disposed therebetween.",

author = "Shailesh Joshi and Naoya Taki and Braun, {Paul V} and Kohanek, {Julia B} and Singhal, {Gaurav S}",

year = "2020",

month = oct,

day = "27",

language = "English (US)",

type = "Patent",

note = "10818576",

}

TY - PAT

T1 - Methods of forming power electronic assemblies using metal inverse opals and cap structures

AU - Joshi, Shailesh

AU - Taki, Naoya

AU - Braun, Paul V

AU - Kohanek, Julia B

AU - Singhal, Gaurav S

PY - 2020/10/27

Y1 - 2020/10/27

N2 - Methods for forming bonded assemblies using metal inverse opal and cap structures are disclosed. In one embodiment, a method for forming a bonded assembly includes positioning a substrate against a polymer support that is porous, depositing a metal onto and within the polymer support, disposing a cap layer to the polymer support opposite of the substrate to form a bottom electrode, and removing the polymer support from between the substrate and the cap layer to form a metal inverse opal structure disposed therebetween.

AB - Methods for forming bonded assemblies using metal inverse opal and cap structures are disclosed. In one embodiment, a method for forming a bonded assembly includes positioning a substrate against a polymer support that is porous, depositing a metal onto and within the polymer support, disposing a cap layer to the polymer support opposite of the substrate to form a bottom electrode, and removing the polymer support from between the substrate and the cap layer to form a metal inverse opal structure disposed therebetween.

M3 - Patent

M1 - 10818576

ER -

Methods of forming power electronic assemblies using metal inverse opals and cap structures

Abstract

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