Methods of forming power electronic assemblies using metal inverse opals and cap structures

Paul V Braun (Inventor), Julia B Kohanek (Inventor), Gaurav S Singhal (Inventor), Shailesh Joshi (Inventor)

Research output: Patent

Abstract

Methods for forming bonded assemblies using metal inverse opal and cap structures are disclosed. In one embodiment, a method for forming a bonded assembly includes positioning a substrate against a polymer support that is porous, depositing a metal onto and within the polymer support, disposing a cap layer to the polymer support opposite of the substrate to form a bottom electrode, and removing the polymer support from between the substrate and the cap layer to form a metal inverse opal structure disposed therebetween.
Original languageEnglish (US)
U.S. patent number10818576
Filing date1/9/19
StatePublished - Oct 27 2020

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