Methods Of Forming Electronic Assemblies With Textured Surfaces Using Low Current Density Electroplating

Paul V. Braun (Inventor), Julia B Kohanek (Inventor), Gaurav S Singhal (Inventor), Shailesh Joshi (Inventor)

Research output: Patent

Original languageEnglish (US)
U.S. patent number11380604
StatePublished - Jul 5 2022

Cite this