Original language | English (US) |
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U.S. patent number | 11380604 |
State | Published - Jul 5 2022 |
Methods Of Forming Electronic Assemblies With Textured Surfaces Using Low Current Density Electroplating
Paul V. Braun (Inventor), Julia B Kohanek (Inventor), Gaurav S Singhal (Inventor), Shailesh Joshi (Inventor)
Research output: Patent