Methods for coating and filling high aspect ratio recessed features

Sreenivas Jayaraman (Inventor), John R Abelson (Inventor), Gregory S Girolami (Inventor), Yu Yang (Inventor), Do Young Kim (Inventor)

Research output: Patent

Abstract

The present invention provides methods for conformally or superconformally coating and/or uniformly filling structures with a continuous, conformal layer or superconformal layer. Methods of the present invention improve conformal or superconformal coverage of surfaces and improve fill in recessed features compared to conventional physical deposition and chemical deposition methods, thereby minimizing formation of voids or gaps in a deposited conformal or superconformal layer. The present methods are capable of coating or filling features useful for the fabrication of a broad class of electronic, electrical and electromechanical devices.
Original languageEnglish (US)
U.S. patent number7592254
StatePublished - Sep 22 2009

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