Methods and devices for fabricating and assembling printable semiconductor elements

Ralph G Nuzzo; John A Rogers; Etienne Menard; Keon Jae Lee; Dahl-Young Khang; Yugang Sun; Matthew Meitl; Zhengtao Zhu

Methods and devices for fabricating and assembling printable semiconductor elements

Ralph G Nuzzo (Inventor), John A Rogers (Inventor), Etienne Menard (Inventor), Keon Jae Lee (Inventor), Dahl-Young Khang (Inventor), Yugang Sun (Inventor), Matthew Meitl (Inventor), Zhengtao Zhu (Inventor)

Research output: Patent

Abstract

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Original language	English (US)
U.S. patent number	11088268
Filing date	6/21/19
State	Published - Aug 10 2021

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title = "Methods and devices for fabricating and assembling printable semiconductor elements",

abstract = "The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.",

author = "Nuzzo, {Ralph G} and Rogers, {John A} and Etienne Menard and Lee, {Keon Jae} and Dahl-Young Khang and Yugang Sun and Matthew Meitl and Zhengtao Zhu",

note = "STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made, at least in part, with United States governmental support awarded by Department of Energy under Grant No. DEFG02-91ER45439 and the Defense Advanced Projects Agency under Contract F8650-04-C-710. The United States Government has certain rights in this invention. ; 11088268",

year = "2021",

month = aug,

day = "10",

language = "English (US)",

type = "Patent",

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TY - PAT

T1 - Methods and devices for fabricating and assembling printable semiconductor elements

AU - Nuzzo, Ralph G

AU - Rogers, John A

AU - Menard, Etienne

AU - Lee, Keon Jae

AU - Khang, Dahl-Young

AU - Sun, Yugang

AU - Meitl, Matthew

AU - Zhu, Zhengtao

N1 - STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made, at least in part, with United States governmental support awarded by Department of Energy under Grant No. DEFG02-91ER45439 and the Defense Advanced Projects Agency under Contract F8650-04-C-710. The United States Government has certain rights in this invention.

PY - 2021/8/10

Y1 - 2021/8/10

N2 - The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

AB - The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

M3 - Patent

M1 - 11088268

Y2 - 2019/06/21

ER -

Methods and devices for fabricating and assembling printable semiconductor elements

Abstract

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