Methods and devices for fabricating and assembling printable semiconductor elements

Yugang Sun (Inventor), Matthew Meitl (Inventor), Dahl-Young Khang (Inventor), Etienne Menard (Inventor), Zhengtao Zhu (Inventor), Keon Jae Lee (Inventor), Ralph G Nuzzo (Inventor), John A Rogers (Inventor)

Research output: Patent

Abstract

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Original languageEnglish (US)
U.S. patent number11088268
Filing date6/21/19
StatePublished - Aug 10 2021

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