Methods and devices for fabricating and assembling printable semiconductor elements

John A Rogers; Etienne Menard; Ralph G Nuzzo; Dahl-Young Khang; Keon Jae Lee; Matthew Meitl; Yugang Sun; Zhengtao Zhu; William Haulbrook; Ron Cok; Michael Schmitt; Peter Rouvalis; Bin Li; Jesus Pindado; Ben Schlatka; Spencer Hoffman

Methods and devices for fabricating and assembling printable semiconductor elements

John A Rogers (Inventor)
, Etienne Menard (Inventor)
, Ralph G Nuzzo (Inventor)
, Dahl-Young Khang (Inventor)
, Keon Jae Lee (Inventor)
, Matthew Meitl (Inventor)
, Yugang Sun (Inventor)
, Zhengtao Zhu (Inventor)
, William Haulbrook (Inventor)
, Ron Cok (Inventor)
, Michael Schmitt (Inventor)
, Peter Rouvalis (Inventor)
, Bin Li (Inventor)
, Jesus Pindado (Inventor)
, Ben Schlatka (Inventor)
, Spencer Hoffman (Inventor)

Research output: Patent

Abstract

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Original language	English (US)
U.S. patent number	12074213
Filing date	6/24/21
State	Published - Aug 27 2024

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title = "Methods and devices for fabricating and assembling printable semiconductor elements",

abstract = "The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.",

author = "Rogers, \{John A\} and Etienne Menard and Nuzzo, \{Ralph G\} and Dahl-Young Khang and Lee, \{Keon Jae\} and Matthew Meitl and Yugang Sun and Zhengtao Zhu and William Haulbrook and Ron Cok and Michael Schmitt and Peter Rouvalis and Bin Li and Jesus Pindado and Ben Schlatka and Spencer Hoffman",

note = "STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made, at least in part, with United States governmental support awarded by Department of Energy under Grant No. DEFG02-91ER45439 and the Defense Advanced Projects Agency under Contract F8650-04-C-710. The United States Government has certain rights in this invention.; 12074213",

year = "2024",

month = aug,

day = "27",

language = "English (US)",

type = "Patent",

}

TY - PAT

T1 - Methods and devices for fabricating and assembling printable semiconductor elements

AU - Rogers, John A

AU - Menard, Etienne

AU - Nuzzo, Ralph G

AU - Khang, Dahl-Young

AU - Lee, Keon Jae

AU - Meitl, Matthew

AU - Sun, Yugang

AU - Zhu, Zhengtao

AU - Haulbrook, William

AU - Cok, Ron

AU - Schmitt, Michael

AU - Rouvalis, Peter

AU - Li, Bin

AU - Pindado, Jesus

AU - Schlatka, Ben

AU - Hoffman, Spencer

N1 - STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made, at least in part, with United States governmental support awarded by Department of Energy under Grant No. DEFG02-91ER45439 and the Defense Advanced Projects Agency under Contract F8650-04-C-710. The United States Government has certain rights in this invention.

PY - 2024/8/27

Y1 - 2024/8/27

N2 - The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

AB - The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

M3 - Patent

M1 - 12074213

Y2 - 2021/06/24

ER -

Methods and devices for fabricating and assembling printable semiconductor elements

Abstract

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