Methodology for expedient computation of semiconductor substrate noise coupling

Giorgos Manetas, Andreas C. Cangellaris

Research output: Contribution to conferencePaperpeer-review

Abstract

A fast semi-analytical modeling methodology is proposed, for expedient computation of semiconductor substrate coupling between substrate contacts. The expediency of the method stems from its ability to calculate analytically the transfer resistance between two contacts for the case of a layered substrate. These transfer resistances are then used for the computation of a conductance matrix representation of the coupling between the contacts. The validity and accuracy of the proposed model is investigated through a series of numerical studies involving semiconductor substrates of properties pertinent to state-of-the-art ICs.

Original languageEnglish (US)
Pages273-276
Number of pages4
StatePublished - 2004
EventIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States
Duration: Oct 25 2004Oct 27 2004

Other

OtherIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
Country/TerritoryUnited States
CityPortland, OR
Period10/25/0410/27/04

ASJC Scopus subject areas

  • General Engineering

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