Abstract
A fast semi-analytical modeling methodology is proposed, for expedient computation of semiconductor substrate coupling between substrate contacts. The expediency of the method stems from its ability to calculate analytically the transfer resistance between two contacts for the case of a layered substrate. These transfer resistances are then used for the computation of a conductance matrix representation of the coupling between the contacts. The validity and accuracy of the proposed model is investigated through a series of numerical studies involving semiconductor substrates of properties pertinent to state-of-the-art ICs.
Original language | English (US) |
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Pages | 273-276 |
Number of pages | 4 |
State | Published - 2004 |
Event | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States Duration: Oct 25 2004 → Oct 27 2004 |
Other
Other | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging |
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Country/Territory | United States |
City | Portland, OR |
Period | 10/25/04 → 10/27/04 |
ASJC Scopus subject areas
- General Engineering