A method for fabricating dielectric encapsulated electrodes. The process includes anodizing a metal to form a dielectric layer with columnar micropores; dissolving a portion of the dielectric layer and then anodizing the resultant structure a second time. The nanoporous structure that results can provide properties superior to those of conventional dielectric encapsulated metals. The pores of the dielectric may be backfilled with one or more materials to further tailor the properties of the dielectric.
|Original language||English (US)|
|U.S. patent number||7297041|
|State||Published - Nov 20 2007|