A magnet assembly for use in high power pulsed magnetron sputtering comprises a configuration of magnets having a magnetic field topology comprising magnetic field components Bx, By and Bz. A tangential magnetic field B// distribution on an x-y plane above the configuration of magnets comprising an outer continuous ring and one or more inner continuous rings contained in the outer continuous ring. A total magnetic field Btot distribution on an x-z plane intersecting the configuration of magnets comprises an outer closed loop and one or more inner closed loops contained in the outer closed loop, where, as a function of x, a tangential magnetic field B// alternates between (a) high field values greater than 200 G and high gradients in the z-direction of at least 1000 G/in, and (b) low field values of less than 50 G and low gradients in the z-direction of at most 250 G/in.
|Original language||English (US)|
|U.S. patent number||10332731|
|State||Published - Jun 25 2019|