TY - GEN
T1 - Metal surface wettability manipulation by nanoparticle deposition during nanofluid boiling
AU - Zhang, Feini
AU - Jacobi, Anthony M.
N1 - Publisher Copyright:
Copyright © 2015 by ASME.
PY - 2015
Y1 - 2015
N2 - Surface wettability of materials is important in heat transfer and thermal processes at micro-scale. This paper presents the manipulation of metal surface wettability by nanofluid boiling nanoparticle deposition. As confirmed by microscopy, particles can be deposited on metal surfaces by boiling in nanoparticle suspension, which significantly enhanced the surface wettabiliy relative to that of its original condition. The change in wettability is coupled to boiling conditions, such as nanoparticle concentration, heat flux, boiling duration, substrate roughness and so on. It has been observed that the higher the concentration of nanoparticles in the liquid during the boiling deposition process, the more pronounced the impact on wetting. Hence, surface wettability can be manipulated by controlling the nanoparticle concentration during the nanofluid boiling nanoparticle deposition (NBND) process. Such method can potentially be applied to enhance the heat transfer performance in thermal devices.
AB - Surface wettability of materials is important in heat transfer and thermal processes at micro-scale. This paper presents the manipulation of metal surface wettability by nanofluid boiling nanoparticle deposition. As confirmed by microscopy, particles can be deposited on metal surfaces by boiling in nanoparticle suspension, which significantly enhanced the surface wettabiliy relative to that of its original condition. The change in wettability is coupled to boiling conditions, such as nanoparticle concentration, heat flux, boiling duration, substrate roughness and so on. It has been observed that the higher the concentration of nanoparticles in the liquid during the boiling deposition process, the more pronounced the impact on wetting. Hence, surface wettability can be manipulated by controlling the nanoparticle concentration during the nanofluid boiling nanoparticle deposition (NBND) process. Such method can potentially be applied to enhance the heat transfer performance in thermal devices.
UR - http://www.scopus.com/inward/record.url?scp=84979971949&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84979971949&partnerID=8YFLogxK
U2 - 10.1115/ICNMM2015-48687
DO - 10.1115/ICNMM2015-48687
M3 - Conference contribution
AN - SCOPUS:84979971949
T3 - ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
BT - ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
PB - American Society of Mechanical Engineers
T2 - ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Y2 - 6 July 2015 through 9 July 2015
ER -