TY - JOUR
T1 - Metal assisted chemical etching for high aspect ratio nanostructures
T2 - A review of characteristics and applications in photovoltaics
AU - Li, Xiuling
N1 - Funding Information:
X. Li is deeply indebted to discussions with and encouragement from her colleagues P. W. Bohn, J.J. Coleman, P. Ferreira, J.A. Rogers, A. Rockett, and S. Sinha; and contribution from her students and postdoctoral researchers, Jae Cheol Shin, Karthik Balasundaram, Matt DeJarld, Mohammad Malik, and Winston Chern. This work was supported in part by NSF under Award Numbers 0749028 (STC) and 0747178 (ECCS CAREER), ARPA-E under Contract No. DOE-DE-AR-0000041PF-ARRA .
Copyright:
Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2012/4
Y1 - 2012/4
N2 - Metal assisted chemical etching (MacEtch) is a recently developed anisotropic wet etching method that is capable of producing high aspect ratio semiconductor nanostructures from patterned metal film. In this review article, we highlight the characteristics of MacEtch of silicon (Si) including controllability of the produced sidewall roughness, the inherent high aspect ratio, the weak crystal orientation dependence, impurity doping and solution concentration dependent porosity, as well as the applicability of MacEtch to non-Si based semiconductor materials including III-V compound semiconductors. Also reviewed are applications of MacEtch produced high aspect ratio Si nanostructures in photovoltaics, where the p-n junction can be in the planar Si tray, core-shell, or axial geometry, with nanowire, micropillar, or hole arrays serving as light trapping or carrier collection structures. The prospect of using MacEtch to improve the cost and efficiency of photovoltaic cells is discussed.
AB - Metal assisted chemical etching (MacEtch) is a recently developed anisotropic wet etching method that is capable of producing high aspect ratio semiconductor nanostructures from patterned metal film. In this review article, we highlight the characteristics of MacEtch of silicon (Si) including controllability of the produced sidewall roughness, the inherent high aspect ratio, the weak crystal orientation dependence, impurity doping and solution concentration dependent porosity, as well as the applicability of MacEtch to non-Si based semiconductor materials including III-V compound semiconductors. Also reviewed are applications of MacEtch produced high aspect ratio Si nanostructures in photovoltaics, where the p-n junction can be in the planar Si tray, core-shell, or axial geometry, with nanowire, micropillar, or hole arrays serving as light trapping or carrier collection structures. The prospect of using MacEtch to improve the cost and efficiency of photovoltaic cells is discussed.
KW - Etching
KW - High aspect ratio
KW - Nanowire
KW - Solar cell
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U2 - 10.1016/j.cossms.2011.11.002
DO - 10.1016/j.cossms.2011.11.002
M3 - Review article
AN - SCOPUS:84862822310
SN - 1359-0286
VL - 16
SP - 71
EP - 81
JO - Current Opinion in Solid State and Materials Science
JF - Current Opinion in Solid State and Materials Science
IS - 2
ER -