Message from the Technical Program Chair and Co-Chairs

Wenquan Che; Raafat Mansour; Xiu Yin Zhang; Songbin Gong; Yuanxin Li; Wanchen Yang; Haoshen Zhu

doi:10.1109/IMWS-AMP54652.2022.10106805

Message from the Technical Program Chair and Co-Chairs

Wenquan Che, Raafat Mansour, Xiu Yin Zhang, Songbin Gong, Yuanxin Li, Wanchen Yang, Haoshen Zhu

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Journal	IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings
DOIs	https://doi.org/10.1109/IMWS-AMP54652.2022.10106805
State	Published - 2022
Event	2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Guangzhou, China Duration: Nov 27 2022 → Nov 29 2022

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Instrumentation

Online availability

10.1109/IMWS-AMP54652.2022.10106805

Library availability

Discover UIUC Full Text

Cite this

@article{7d6a4ddd4fa043619cf96414306038d4,

title = "Message from the Technical Program Chair and Co-Chairs",

author = "Wenquan Che and Raafat Mansour and Zhang, {Xiu Yin} and Songbin Gong and Yuanxin Li and Wanchen Yang and Haoshen Zhu",

year = "2022",

doi = "10.1109/IMWS-AMP54652.2022.10106805",

language = "English (US)",

journal = "IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings",

note = "2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 ; Conference date: 27-11-2022 Through 29-11-2022",

}

TY - JOUR

T1 - Message from the Technical Program Chair and Co-Chairs

AU - Che, Wenquan

AU - Mansour, Raafat

AU - Zhang, Xiu Yin

AU - Gong, Songbin

AU - Li, Yuanxin

AU - Yang, Wanchen

AU - Zhu, Haoshen

PY - 2022

Y1 - 2022

UR - http://www.scopus.com/inward/record.url?scp=85159182872&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85159182872&partnerID=8YFLogxK

U2 - 10.1109/IMWS-AMP54652.2022.10106805

DO - 10.1109/IMWS-AMP54652.2022.10106805

M3 - Editorial

AN - SCOPUS:85159182872

JO - IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings

JF - IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings

T2 - 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022

Y2 - 27 November 2022 through 29 November 2022

ER -

Message from the Technical Program Chair and Co-Chairs

ASJC Scopus subject areas

Online availability

Library availability

Related links

Cite this