Mechanism of electrochemical reduction of hydrogen peroxide on copper in acidic sulfate solutions

Karen L. Stewart, Andrew A Gewirth

Research output: Contribution to journalArticlepeer-review

Abstract

Hydrogen peroxide is a commonly used oxidizer component in chemical mechanical planarization slurries, used in the processing of Cu metallization in microelectronics applications. We studied the electrochemical reduction of hydrogen peroxide on Cu in 0.1 M H2SO4 solutions using methods including cyclic voltammetry, rotating disk electrode experiments, surface-enhanced Raman spectroscopy, and density functional dieory (DFT) calculations. The spectroscopy reveals that the hydrogen peroxide molecule is reduced at negative potentials to form a Cu-OH surface species in acidic solutions, a result consistent with the insight from Tafel slope measurements. DFT calculations support the instability of peroxide relative to the surface-coordinated hydroxide on both Cu(111) and Cu(100) surfaces.

Original languageEnglish (US)
Pages (from-to)9911-9918
Number of pages8
JournalLangmuir
Volume23
Issue number19
DOIs
StatePublished - Sep 11 2007

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

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