Mechanics of stretchable electronics with high fill factors

Yewang Su; Zhuangjian Liu; Seok Kim; Jian Wu; Yonggang Huang; John A. Rogers

doi:10.1016/j.ijsolstr.2012.07.024

Mechanics of stretchable electronics with high fill factors

Yewang Su, Zhuangjian Liu, Seok Kim, Jian Wu, Yonggang Huang, John A. Rogers

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

Mechanics models are developed for an imbricate scale design for stretchable and flexible electronics to achieve both mechanical stretchability and high fill factors (e.g., full, 100% areal coverage). The critical conditions for self collapse of scales and scale contact give analytically the maximum and minimum widths of scales, which are important to the scale design. The maximum strain in scales is obtained analytically, and has a simple upper bound of 3t _scale/(4ρ) in terms of the scale thickness t _scale and bending radius ρ.

Original language	English (US)
Pages (from-to)	3416-3421
Number of pages	6
Journal	International Journal of Solids and Structures
Volume	49
Issue number	23-24
DOIs	https://doi.org/10.1016/j.ijsolstr.2012.07.024
State	Published - Nov 15 2012

Keywords

Biomimetics
Self collapse
Stretchability and bendability
Stretchable electronics
Transfer printing

ASJC Scopus subject areas

Mechanical Engineering
Mechanics of Materials
General Materials Science
Condensed Matter Physics
Applied Mathematics
Modeling and Simulation

Online availability

10.1016/j.ijsolstr.2012.07.024

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Cite this

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title = "Mechanics of stretchable electronics with high fill factors",

abstract = "Mechanics models are developed for an imbricate scale design for stretchable and flexible electronics to achieve both mechanical stretchability and high fill factors (e.g., full, 100% areal coverage). The critical conditions for self collapse of scales and scale contact give analytically the maximum and minimum widths of scales, which are important to the scale design. The maximum strain in scales is obtained analytically, and has a simple upper bound of 3t scale/(4ρ) in terms of the scale thickness t scale and bending radius ρ.",

keywords = "Biomimetics, Self collapse, Stretchability and bendability, Stretchable electronics, Transfer printing",

author = "Yewang Su and Zhuangjian Liu and Seok Kim and Jian Wu and Yonggang Huang and Rogers, {John A.}",

note = "Funding Information: The authors acknowledge support from NSF Grant Nos. ECCS-0824129 and OISE-1043143 , and DOE, Division of Materials Sciences Grant No. DE-FG02-07ER46453 .",

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doi = "10.1016/j.ijsolstr.2012.07.024",

language = "English (US)",

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T1 - Mechanics of stretchable electronics with high fill factors

AU - Su, Yewang

AU - Liu, Zhuangjian

AU - Kim, Seok

AU - Wu, Jian

AU - Huang, Yonggang

AU - Rogers, John A.

N1 - Funding Information: The authors acknowledge support from NSF Grant Nos. ECCS-0824129 and OISE-1043143 , and DOE, Division of Materials Sciences Grant No. DE-FG02-07ER46453 .

PY - 2012/11/15

Y1 - 2012/11/15

N2 - Mechanics models are developed for an imbricate scale design for stretchable and flexible electronics to achieve both mechanical stretchability and high fill factors (e.g., full, 100% areal coverage). The critical conditions for self collapse of scales and scale contact give analytically the maximum and minimum widths of scales, which are important to the scale design. The maximum strain in scales is obtained analytically, and has a simple upper bound of 3t scale/(4ρ) in terms of the scale thickness t scale and bending radius ρ.

AB - Mechanics models are developed for an imbricate scale design for stretchable and flexible electronics to achieve both mechanical stretchability and high fill factors (e.g., full, 100% areal coverage). The critical conditions for self collapse of scales and scale contact give analytically the maximum and minimum widths of scales, which are important to the scale design. The maximum strain in scales is obtained analytically, and has a simple upper bound of 3t scale/(4ρ) in terms of the scale thickness t scale and bending radius ρ.

KW - Biomimetics

KW - Self collapse

KW - Stretchability and bendability

KW - Stretchable electronics

KW - Transfer printing

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Mechanics of stretchable electronics with high fill factors

Abstract

Keywords

ASJC Scopus subject areas

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