TY - GEN
T1 - Mechanical effects of attaching protein layers on nanoscale-thick cantilever beams for resonant detection of virus particles
AU - Gupta, A.
AU - Akin, D.
AU - Bashir, R.
PY - 2005
Y1 - 2005
N2 - The purpose of this paper is to present experimental results on the alteration of mechanical properties and stiffness constant of nanoscale thick cantilever beams upon attachment of protein layers to the top and bottom surfaces of silicon cantilever beams. Depending on the initial unloaded spring constant value of the cantilever beams, the resonant frequencies were observed to either increase or decrease upon attachment of the protein layers. This depends on whether the increase in spring constant out-weighs the increase in the added mass or vice-versa. The spring constant demarcation value at which the resonant frequency will either increase or decrease is estimated to be around 0.01 N/m for the present study.
AB - The purpose of this paper is to present experimental results on the alteration of mechanical properties and stiffness constant of nanoscale thick cantilever beams upon attachment of protein layers to the top and bottom surfaces of silicon cantilever beams. Depending on the initial unloaded spring constant value of the cantilever beams, the resonant frequencies were observed to either increase or decrease upon attachment of the protein layers. This depends on whether the increase in spring constant out-weighs the increase in the added mass or vice-versa. The spring constant demarcation value at which the resonant frequency will either increase or decrease is estimated to be around 0.01 N/m for the present study.
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U2 - 10.1109/MEMSYS.2005.1454037
DO - 10.1109/MEMSYS.2005.1454037
M3 - Conference contribution
AN - SCOPUS:26844515702
SN - 0780387325
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 746
EP - 749
BT - Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest
T2 - 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
Y2 - 30 January 2005 through 3 February 2005
ER -